Conprofe Technology Co., Ltd.

We’re excited to share highlights from our successful participation at SEMICON Taiwan 2025, held from September 10–12 at Taipei Nangang Exhibition Center. At Booth Q5636, Conprofe showcased innovative High-Efficiency Ultrasonic Machining Solutions tailored for the semiconductor industry—drawing significant attention from professionals across global markets.

Ultrasonic Technology Emerges as a Key Focus, Garnering Strong Validation in Taiwan

Over the first two days of the exhibition, we had the privilege of hosting Mr. Lung Chu, the President of SEMI China, as well as representatives from leading Taiwanese semiconductor manufacturing companies including BEST, Feedback Technology, Hermes-Epitek, FORCERA, and Gudeng Precision Industrial. These engagements involved in-depth technical exchanges and collaboration discussions centered on Conprofe’s Ultrasonic CNC Machine Tools, Solid PCD Cutting Tools, and other core products.

In addition, our core distributors in Taiwan—including LiFu Co., Ltd. and Road Ahead Technologies—provided outstanding local support, delivering “localized + professional” solution interpretations to visitors and reinforcing our market presence.

The positive feedback we received reaffirms the value and performance of Conprofe’s Ultrasonic CNC Solutions in meeting the stringent demands of the semiconductor sector.

How Conprofe Enables High-Efficiency Precision Machining for Semiconductor Parts

As the backbone of modern electronics, semiconductor manufacturing involves vastly higher complexity and precision requirements than traditional industries. Conprofe specializes in developing High-End Ultrasonic-Green CNC Machine Tools and Key Units designed to tackle these challenges head-on.

Our approach integrates Ultrasonic Technology with CNC machining, supported by high-performance tooling systems. This combination delivers an efficient and flexible machining solution—whether for processing hard-brittle materials, metals, or engineering plastics in ultra-deep micro-hole drilling, or achieving micron-level surface finishes. The results are clear: improved processing efficiency, superior surface quality, and continuous, stable production.

Expanding Reach Across Taiwan and Southeast Asia—Accelerating Global Semiconductor Footprints

SEMICON exhibitions are among the most influential events in the global semiconductor industry. After an impressive showing at SEMICON China in Shanghai this March, our participation in SEMICON Taiwan marks another milestone in Conprofe’s worldwide outreach.

And we’re not stopping there.

We will also exhibit at:

• SEMICON West (October 7–9, Phoenix, AZ)

• SEMICON Japan (December 17–19, Tokyo)

These events will further strengthen our brand presence across North American and Asian markets.

Thank you to everyone who visited us at SEMICON Taiwan. We look forward to continuing these conversations and building new partnerships around the world.