Conprofe Technology Co., Ltd.

In high-precision manufacturing, the difference between meeting specifications and exceeding them often comes down to how well a machine manages heat, vibration, and motion control. The UHM150-5AXIS Vertical High-Speed Precision Machining Center, developed by Conprofe, is a compact, lightweight CNC platform engineered to address these challenges directly. It combines a thermally symmetric cast iron structure, linear motor drives, and an integrated ultrasonic machining system to deliver stable, high-accuracy performance across a range of demanding applications.

Machine Structure and Design

The UHM150-5AXIS is built around a thermally symmetric frame structure in cast iron, a material selected for its excellent vibration damping characteristics. This design reduces the influence of ambient temperature fluctuations on machine geometry, helping to maintain high rigidity and dimensional consistency throughout the workday. A thermal separation system further supports stability: the spindle, electrical cabinet, linear motors, cutting fluid, and the internal spaces of the X, Y, and Z axes are each equipped with dedicated cooling or temperature-control systems. This layered approach to thermal management is intended to keep precision stable even during extended machining cycles.

Despite its capability, the machine has a small physical footprint. The complete unit weighs approximately 1,500 kg, making it suitable for workshops where space is at a premium. The X/Y/Z axes use a stacked configuration positioned away from the machining area, which improves protection of the guideways and linear encoders from chips and coolant. All three linear axes are driven by linear motors paired with linear encoders, forming a high-speed, high-precision motion platform. The Z-axis additionally employs a balance cylinder to reduce load on the Z-axis motor, supporting both accuracy and high acceleration.

Key Configuration Highlights

The UHM150-5AXIS is designed for flexibility in complex part machining. Its work envelope allows for multi-face machining of complex cavities, inclined surfaces, and freeform geometries in a single setup. With RTCP compensation, the machine automatically corrects tool tip position in real time during five-axis simultaneous motion, effectively eliminating coordinate deviations introduced by the rotary axes.

Tool changing is handled by a disc-type tool magazine with a double-magazine capacity of up to 24 tools. The magazine door features a dynamic protective structure to prevent chip ingress. For position feedback, all three linear axes are equipped with Renishaw enclosed linear encoders featuring nanometric resolution and an accuracy of 5 μm/m. These encoders are designed for high resistance to vibration and shock, with low signal jitter and minimal interpolation error, ensuring reliable feedback even in demanding shop-floor conditions.

The machine also offers Conprofe’s proprietary intelligent ultrasonic machining technology. Customers can choose between a 40,000 rpm ultrasonic spindle or a 160,000 rpm high-speed air-bearing electric spindle, making the platform suitable for hard-brittle materials and difficult-to-machine metals.

Application Case: Micro-Hole Machining in Engineering Plastics

A recent application demonstrates the platform’s capabilities in semiconductor-related manufacturing. Conprofe combined the UHM150-5AXIS with Ultrasonic Machining Technology, an Ultrasonic Amplitude Measuring Device, and a TBPS Tool Breakage Prognosis and Monitoring System to address a challenging micro-hole drilling task in engineering plastic chip test sockets.

The results were significant. The process achieved a minimum hole spacing of 0.35 mm and a minimum wall thickness of 0.03 mm. Hole-edge burrs were reduced by 72%, and the micro-hole burr defect rate dropped to 0.2%. Key metrics including hole diameter, roundness, positional accuracy, coaxiality, and chamfer depth all exceeded customer targets by a considerable margin. This case illustrates how the combination of a stable machine platform, ultrasonic assistance, and real-time process monitoring can extend precision machining into geometries that are otherwise difficult to control.

See the UHM150-5AXIS in Person

Conprofe will present its semiconductor precision machining solutions at the SEMICON West exhibition in the United States from October 13–15. Attendees are invited to visit Booth 3229 to discuss the UHM150-5AXIS in detail with Conprofe’s technical experts and explore the future of precision machining for semiconductor applications.

For more information or to schedule a meeting, please contact our team.