Conprofe Technology Co., Ltd.

The semiconductor industry continues to push the limits of miniaturization, particularly for ultra-deep micro-holes in hard-brittle materials, advanced engineering plastics, and difficult-to-cut metals. Meeting these demands requires more than just high spindle speeds—it demands system-level stability, real-time process monitoring, and micron-level accuracy.

At SEMICON SEA 2026, held from May 5-7 at MITEC Kuala Lumpur, Conprofe is showcasing exactly that. At Booth 2161, Conprofe presents a one-stop turnkey solution for ultrasonic machining of ultra-deep micro-holes — integrating intelligent machining centers, precision tooling, accessories, and process expertise into a cohesive ecosystem.

Flagship Ultrasonic-Green CNC Machining Center

The centerpiece is Conprofe’s Ultrasonic-Green Engraving and Milling Center ULW-500– a model recognized with the SEMI Product Innovation Award First Prize. Key technical highlights include:

• 36,000 rpm intelligent ultrasonic spindle (Conprofe proprietary technology)

• Integrated tool monitoring system for real-time wear and breakage detection of small-diameter tools

• Full closed-loop control with linear encoder: positioning accuracy ≤2.5μm, repeatability ≤1.8μm over full travel

• Optimized for deep micro-hole drilling in semiconductor components, consumer electronics parts, and difficult-to-cut metals

• For semiconductor precision parts, especially those requiring ultra-deep micro-holes with high aspect ratios, this platform delivers measurable improvements in tool life, hole quality, and process consistency.

Beyond the Machine: A Complete Tooling Ecosystem

Conprofe also features a comprehensive range of supporting products, including Solid PCD Cutting Tools for advanced semiconductor materials, Press-Fit Tool Holders and a Press-Fit Unit that reduces thermal impact on tool assembly, as well as Micro-Diameter Forming Taps for thread forming in challenging materials. Together with the Ultrasonic-Green CNC machining center, these products form a one-stop turnkey machining solution — from individual tools to fully integrated systems.

Live Technical Experience Zones

To help visitors understand real performance, Conprofe has set up two dedicated interactive zones — an Ultrasonic Vibration and Amplitude Measurement Experience Zone, and a Micro-Hole Observation Zone — where on-site technicians provide application consulting and equipment operation guidance, allowing visitors to compare conventional versus ultrasonic-assisted machining results side by side.

Local Partnership Strengthening Regional Support

Mr. Hock Ann Lee, Director of Conprofe’s Singapore distributor OKAMOTO KAI C & R PTE LTD, is actively supporting the booth, explaining product benefits and real-world application cases. This collaboration underscores Southeast Asia’s strategic position as a “manufacturing hub” in the global semiconductor industry.

Conprofe and its regional distributors are committed to deepening support for Malaysia and the broader Southeast Asian semiconductor supply chain – from component-level precision to high-value complex part manufacturing.

Visit Conprofe at SEMICON SEA 2026

The exhibition runs through May 7. Welcome to stop by Booth 2161, MITEC to see live demonstrations, discuss your specific machining challenges, and explore how our ultrasonic technology can improve your semiconductor precision manufacturing processes.

We look forward to connecting with you – and if you’re at SEMICON SEA, please come meet the Conprofe team in person at Booth 2161.