Cases-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Single Crystal Silicon Curved Electrode

Material: Single-crystal silicon

Machine tool: ULW-600

Industry: Semiconductors

Cutting tool: Solid PCD Drill

Features: D0.45x24.75mm ultra-deep micro-hole drilling

Benefits: Continuous machining of over 2,000 ultra-deep holes; Hole roundness up to 0.003mm; Hole wall roughness down by 99.8%, from Sa 6.540μm to Sa 0.013μm

Single Crystal Silicon Curved Electrode

Material: Single-Crystal Silicon

Machine Tool: ULW-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.45x24.75mm Ultra-Deep Micro-Hole Drilling

Benefits: Continuous machining of over 2,000 ultra-deep holes; Hole roundness up to 0.003mm; Hole wall roughness down by 99.8%, from Sa 6.540μm to Sa 0.013μm

Single Crystal Silicon Curved Electrode

Material: Single-crystal silicon

Machine tool: ULW-600

Industry: Semiconductors

Cutting tool: Solid PCD Drill

Features: D0.45x24.75mm ultra-deep micro-hole drilling

Benefits: Continuous machining of over 2,000 ultra-deep holes; Hole roundness up to 0.003mm; Hole wall roughness down by 99.8%, from Sa 6.540μm to Sa 0.013μm

Engineering Plastic Probe Card

Material: Engineering Plastic

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.22mm / D0.31mm Stepped Hole Drilling

Benefits: Stable micro-hole drilling for D0.22mm / D0.31mm holes; Entrance burrs reduced by 70%, from 0.095mm to 0.028mm; ATAN achieved: 25.462° (standard: 25.463°)

Engineering Plastic Probe Card

Material: Engineering Plastic

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.22mm / D0.31mm Stepped Hole Drilling

Benefits: Stable micro-hole drilling for D0.22mm / D0.31mm holes; Entrance burrs reduced by 70%, from 0.095mm to 0.028mm; ATAN achieved: 25.462° (standard: 25.463°)

CVD SiC Showerhead

Material: CVD SiC (HV 3,150)

Machine Tool: ULW-600 PLUS

Industry: Semiconductors

Cutting Tool: High-Speed PCD Drill

Features: D1.0x5.8mm/D0.5x5.4mm Stepped Hole Drilling

Benefits: Efficiency up by 47.8%, from 11ʹ25ʺ to 5ʹ58ʺ per D1.0/D0.5mm stepped hole; Tool life up by 160%, with machining cost down by 50%; Edge chipping ≤ 0.02mm at hole entrance (under ×50 magnification)

Polysilicon Confinement Ring

Material: Polysilicon

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Contouring, grinding and grooving

Benefits: Edge chipping decreased by 75%, from 0.12mm to 0.03mm; Cycle time reduced by 21%, from 208h to 165h; Improved roundness

Polysilicon Confinement Ring

Material: Polysilicon

Machine tool: ULW-600

Industry: Semiconductors

Solution: Vertical DDR High-speed Rotary Table

Features: Contouring, grinding and grooving

Benefits: Edge chipping decreased by 75%, from 0.12mm to 0.03mm; Cycle time reduced by 21%, from 208h to 165h; Improved roundness

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