Cases-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals Engineering Plastics

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Substrate

Material: Quartz Glass

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Chamfer and Side Machining (Required Roughness: Ra<150nm)

Benefits: Cycle time down by 79%, from 120min/pc to 25min/pc; Surface roughness down by 82%, from Ra 560nm to <100nm, without grinding marks

Substrate

Material: Quartz Glass

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Chamfer and Side Machining (Required Roughness: Ra<150nm)

Benefits: Cycle time down by 79%, from 120min/pc to 25min/pc; Surface roughness down by 82%, from Ra 560nm to <100nm, without grinding marks

Showerhead

Material: Silicon Carbide (HV3,150)

Machine Tool: ULW-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D1.0x5.8mm/D0.5*5.4mm Stepped Hole Drilling

Benefits: Machining efficiency up by 47.8%, from 11'25" to 5'58" per D1.0/D0.5mm stepped hole; Tool life up by 160%, with machining cost down by 50%; Edge chipping ≤ 0.02mm at hole entrance (under x50 magnification)

Showerhead

Material: Silicon Carbide (HV2,700)

Machine Tool: ULW-500

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x6.5mm/D1x6.5mm Stepped Hole Drilling

Benefits: Continuously drilling over 100 holes; Smooth hole wall and hole edge chippings of less than 0.02mm

Wafer Disc

Material: Silicon Carbide

Machine Tool: ULW-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

Wafer Disc

Material: Silicon Carbide

Machine Tool: ULW-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

Wafer Disc

Material: Silicon Carbide

Machine Tool: ULW-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

AlSiC Workpiece

Material: AISiC (60% SiC)

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill + Thread Mill

Features: Thread Hole Drilling

Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes

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