Cases-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Wafer Disc

Material: Silicon Carbide

Machine Tool: UEM-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

Wafer Disc

Material: Silicon Carbide

Machine Tool: UEM-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

AlSiC Workpiece

Material: AISiC (60% SiC)

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill + Thread Mill

Features: Thread Hole Drilling

Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes

AlSiC Workpiece

Material: AISiC (60% SiC)

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill + Thread Mill

Features: Thread Hole Drilling

Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes

AlSiC Workpiece

Material: AISiC (60% SiC)

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill + Thread Mill

Features: Thread Hole Drilling

Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes

Single-Crystal Silicon Ring

Material: Single-Crystal Silicon

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Profile Grinding

Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm

Single-Crystal Silicon Ring

Material: Single-Crystal Silicon

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Profile Grinding

Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm

Single-Crystal Silicon Ring

Material: Single-Crystal Silicon

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Profile Grinding

Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm

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