Material: AISiC (60% SiC)
Machine Tool: ULW-400
Industry: Semiconductors
Cutting Tool: Solid PCD Drill + Thread Mill
Features: Thread Hole Drilling
Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes
Material: Single-Crystal Silicon
Machine Tool: ULW-600
Solution: Vertical DDR High-Speed Rotary Table
Features: Profile Grinding
Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm
Material: Quartz Glass
Machine Tool: UGT-500
Solution: Ultrasonic Machining System
Features: Through-Hole Drilling (D7.8x250mm with 32xD)
Benefits: Hole wall roughness Sa<0.122μm; Holes parallelism <0.013mm
Material: Graphite
Machine Tool: UPG-500
Features: Cavity Milling
Benefits: Cutting force reduction with ultrasonic-assisted machining; Cycle time significantly down by 12.5%, from 240mins to 210mins; Multi-layer protection and long tool life
