Cases-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Showerhead

Material: Aluminum Alloy 6061

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.7x20mm Through-Hole Drilling (Depth-Diameter Ratio 28.6:1)

Benefits: Qualified hole size; Qualified average hole wall roughness (Ra 0.342μm)

Showerhead

Material: Aluminum Alloy 6061

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.7x20mm Through-Hole Drilling (Depth-Diameter Ratio 28.6:1)

Benefits: Qualified hole size; Qualified average hole wall roughness (Ra 0.342μm)

Showerhead

Material: Alumina

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x3.2mm/D1x5.8mm Hold Drilling (6xD)

Benefits: Tool life up by over 34%, from 560 holes to 750 holes

Showerhead

Material: Alumina

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x3.2mm/D1x5.8mm Hold Drilling (6xD)

Benefits: Tool life up by over 34%, from 560 holes to 750 holes

Showerhead

Material: Alumina

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x3.2mm/D1x5.8mm Hold Drilling (6xD)

Benefits: Tool life up by over 34%, from 560 holes to 750 holes

Multi-Dimension Mirror

Material: Quartz Glass

Machine Tool: ULV200-5AXIS

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Profile Grinding

Benefits: Lower cutting force for higher efficiency with ultrasonic-assisted machining; Easier to control polishing dimension with mirror-level roughness of Sa<70nm

Multi-Dimension Mirror

Material: Quartz Glass

Machine Tool: ULV200-5AXIS

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Profile Grinding

Benefits: Lower cutting force for higher efficiency with ultrasonic-assisted machining; Easier to control polishing dimension with mirror-level roughness of Sa<70nm

Multi-Dimension Mirror

Material: Quartz Glass

Machine Tool: ULV200-5AXIS

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Profile Grinding

Benefits: Lower cutting force for higher efficiency with ultrasonic-assisted machining; Easier to control polishing dimension with mirror-level roughness of Sa<70nm

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