Conprofe Technology Co., Ltd.

2026-01-16

Beyond Limits in Micro-Hole Drilling: Conprofe’s Ultrasonic Dual-Spindle Solution

Tired of choosing between speed and precision? The game has changed. Conprofe proudly introduces the Dual-Spindle Ultrasonic Engraving and Milling Center – engineered to double your throughput while mastering the toughest materials.

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2026-01-06

Machining Alumina Ceramics? Conprofe's Ultrasonic-Green Solution Is a Game-Changer

Let's explore that how Conprofe’s innovative turnkey Ultrasonic-Green Machining Solutions are setting new benchmarks for precision, efficiency, and reliability in processing alumina ceramics.

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2025-12-01

Conprofe Forming Taps: Boosting Efficiency in Electronics Manufacturing

Try Conprofe Micro-Diameter Forming Taps ideally suited for tough yet malleable materials like stainless steel, aluminum alloys, copper, and zinc alloys.

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2025-11-12

How Conprofe Delivers CNC Solutions That Boost Production Efficiency and Reap Eco-Friendly Benefits

Conprofe is pioneering sustainable CNC machining with three core green technologies: MQL, ScCO2, and Cryogenic Air Blasting.

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2025-08-13

0.027mm Burrs in Micro-Hole Drilling: The Ultrasonic Precision Standard Redefines Probe Card Manufacturing

Conprofe’s UEM Ultrasonic Machining Solution revolutionizes probe card manufacturing by enabling stable micro-hole drilling of D0.22mm/D0.31mm stepped holes while dramatically improving quality - reducing entrance burrs by 72% from 0.095mm to just 0.027mm!

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2025-07-29

From 120 Mins to 25 Mins: The UAM Breakthrough Reshaping Glass Substrate Production

Conprofe Ultrasonic Machining solution integrates the Ultrasonic Engraving and Milling Center UEM-400 and Solid PCD Micro-Edge Cutting Tools to deliver unmatched efficiency for quartz glass substrates.

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2025-07-17

Breakthrough in SiC Showerhead Machining! 47.8% Shorter Cycle Time, 160% Longer Tool Life & 50% Cost Reduction

Conprofe's solution reduces D1.0/D0.5mm stepped hole processing time to just 358 seconds, 47.8% faster than traditional machining technologies, while extending tool life by 160% and cutting machining costs by 50%.

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2025-06-13

The Semiconductor Industry's SiC Dilemma: Material Challenges vs. Manufacturing Reality

Silicon Carbide (SiC) is revolutionizing the semiconductor industry with its superior thermal conductivity, high breakdown voltage, and extreme durability. Ultrasonic-Assisted Machining delivers reduced chipping & cracking, superior surface finish and improved efficiency, bringing higher productivity for your semiconductor applications.

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2025-05-26

South Korea’s Carbon Fiber Industry: A Global Leader in Innovation & Sustainability

Exciting insights from the recent article “Advancing Carbon Fiber and its Composites Technology: Korea’s Strategic Growth and Innovation” (published in Composites Part B: Engineering) highlight South Korea’s pivotal role in carbon fiber manufacturing and its global impact on sustainability and tech innovation. A Robust & Diverse Industry: Korea’s carbon fiber sector

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