Workpiece
- Single Crystal Silicon
- Evenly distributed D0.45x23mm blind holes
- Depth-Diameter Ratio: 51:1
Challenges
- Hole wall roughness ≥Ra 6.54μm
- Hole roundness ≥0.025mm
Benefits
- Continuous machining of over 1,000 D0.45x23mm ultra-deep holes
- No obvious chipping around hole edges
- Hole roundness 0.003mm
- Hole wall roughness down by 99%, from Ra 6.54μm to Ra 0.088μm